Our manufacturing capabilities are built on modern, automated production technologies designed to support reliable, high-quality electronics manufacturing.
Our technology base combines advanced equipment, controlled processes and in-process inspection to ensure consistent results across a wide range of electronic products. The manufacturing environment is designed to support high-mix production, frequent product changeovers and stable series manufacturing without compromising quality.
By integrating automation, inspection and process control throughout the production flow, we are able to maintain predictable quality performance and repeatable manufacturing results. Our technology selection reflects a focus on long-term reliability, manufacturability and efficient industrialization of electronic products.
Automated SMT Production Lines
We operate two fully automated SMT production lines equipped with high-precision placement, inspection and soldering technologies.
Our SMT lines are based on Panasonic and Samsung / Hanwha pick-and-place systems, supporting:
- Components down to 0201 size
- Fine-pitch packages including QFP, BGA and µBGA
- Single- and double-sided assemblies
Solder paste quality is verified using Koh Young 3D Solder Paste Inspection (SPI) systems, ensuring consistent paste deposition before component placement.
Controlled reflow soldering is performed using multi-zone reflow ovens with 9 heating and 4 cooling zones, enabling precise thermal profiling across all stages of the soldering process.
Selective Soldering (THT)
For through-hole and mixed-technology assemblies, we use automated in-line selective soldering system from Ersa, enabling controlled and repeatable soldering results.
The 3-zone in-line selective soldering process allows precise control of flux application, preheating and soldering parameters while minimizing thermal stress on the PCB. This is particularly important for assemblies combining SMT and THT components.
Selective soldering ensures consistent solder joint quality and reduces the need for manual soldering, making it well suited for series production of complex or densely populated PCBs.
X-ray Inspection
For assemblies with hidden solder joints, we use a Nikon X-ray inspection system as a non-destructive method to verify soldering quality.
The system is equipped with a microfocus X-ray source, enabling detailed inspection of components such as BGA, QFN and LGA packages, where solder joints cannot be assessed using optical inspection methods. Real-time 2D imaging is available, and 3D inspection can be applied where required.
A rotating inspection table with a wide tilt angle allows oblique viewing of solder joints, supporting the detection of solder voids, insufficient or excessive solder and other internal defects. X-ray inspection is typically applied during first article inspection and selected sampling to ensure reliable assembly quality.
Electronics Cleaning
PCB assemblies are cleaned using automated DCT cleaning systems to remove flux residues and process-related contaminants after soldering.
Automated cleaning supports consistent and repeatable results, even for densely populated assemblies. The closed-loop cleaning process includes washing, rinsing and drying in a controlled environment, ensuring effective residue removal without mechanical stress on the PCB.
Electronics cleaning is particularly important for assemblies requiring conformal coating, long-term reliability or compliance with cleanliness requirements for industrial and professional applications.
Automated Optical Inspection
PCB assemblies are inspected using Koh Young true 3D Automated Optical Inspection (AOI) systems, widely recognized as an industry benchmark for 3D inspection technology.
Koh Young AOI systems are based on precise 3D measurement rather than image comparison, enabling reliable inspection of component placement and solder joints regardless of component color, reflectivity or lighting conditions. This measurement-based approach supports accurate detection of placement deviations and soldering issues that may not be visible using conventional 2D inspection.
The high measurement accuracy and stability of Koh Young systems make them particularly well suited for fine-pitch components and densely populated PCBs. Inspection results can be used for process monitoring and continuous improvement, supporting stable production performance over time.
Automated optical inspection provides immediate process feedback, enabling early defect detection and reducing rework rates. This contributes to consistent quality performance, especially in high-mix and series manufacturing environments.
Automated Conformal Coating
Conformal coating is applied using Nordson ASYMTEK selective coating systems, enabling precise, automated application with high repeatability.
Selective coating technology allows accurate control of coating paths and layer thickness, protecting only the defined PCB areas while avoiding connectors, test points and sensitive components. This is particularly important for complex or densely populated assemblies where manual coating would introduce variability.
Automated conformal coating supports consistent protection against moisture, dust, chemicals and environmental stress while maintaining stable process quality in series production. The controlled application process also ensures reproducible results across production batches.
Interested in our manufacturing technologies?
If you would like to learn more about our production capabilities or discuss how our technology supports your project, we are happy to help.
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